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It’s all about the chemistry for advanced lithography
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What Makes Us Different – Specializing Chemistry to the Needs of Micro / Nano Fabrication. Tell us what you need, We’ll Listen.
NEW PRODUCT!
Negative Tone EBL Resist
DisChem H-SiQ is a negative tone hydrogen silesquioxane resist derived from dry silica resin (H-SiOx) in semiconductor grade MIBK carrier solvent for use in electron beam lithography (EBL). H-SiQ is characterized by excellent pitch resolution, sensitivity and etch resistance for direct write thin film EBL applications.
Immediate availability: lead time less than one week with 100% shelf life!
Microlithography
Resist Adhesion
SurPass is a waterborne agent designed to promote adhesion and improve overall coating quality on a broad range of substrate materials used in photon and electron beam lithography.
E-Beam Lithography Anti-Charging Agents
DisCharge is an anti-charging agent used in electron-beam lithography for preventing charge accumulation on electrically insulated substrates.
Optical Substrate Cleaner
DisClean is a cationic surface active agent designed to remove water stains, oxidation products, organic residues and electrostatic contaminants from optical electroforms and substrates.
Electroforming
E-Form is an electronic grade sulfamate nickel low stress electroforming concentrate designed and manufactured specifically for use in electronics manufacturing
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