SurPass Microlithography Adhesion Promoters
Advantages in Lithographic Processing :
Improved resist and polymer adhesion on a broad range of substrate materials
Increased adhesion of evaporated metals to substrate materials
Reduced z-potential for improved coating properties
Replaces pre-wetting solvents
Improved wet chemical resistance
May eliminate the need for thermally matched glass
Eliminates need for substrate dehydration bake prior to resist coating
Non-Hazardous waterborne formulation.
No VOC or hazardous breakdown products
In addition to promoting adhesion, SurPass modifies the available surface energy to provide a more uniform coating surface for improved resist flow . Evidence suggests that SurPass may be used in polyimide processing to both improve performance and reduce material consumption through reduced Zeta potential. SurPass provides improved coating flow and uniformity even where resist / polymer adhesion is not an issue.
SurPass is manufactured in two versions designated as SurPass 3000 and SurPass 4000. SurPass 3000 is mildly acidic (3.0-3.5) and contains a cleaning and surfactant package for enhanced performance. SurPass 4000 is slightly alkaline (9.0-9.5) and contains no additives. Both versions are waterborne and non-hazardous. Unlike silanes (HMDS), SurPass is not limited to Si-substrates materials. No ammonia or breakdown products are formed during application. Both versions of SurPass are waterborne, non-hazardous, and contain no volatile organic compounds (VOC’s).