Microlithography Adhesion

SurPass Microlithography Adhesion Promoters

SurPass is a waterborne agent designed to promote adhesion and improve overall coating quality on a broad range of substrate materials used in photon and electron beam lithography. SurPass promotes resist adhesion through modification of the substrate surface energy with no deposition on or chemical alteration of the substrate material.

Advantages in Lithographic Processing :

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Improved resist and polymer adhesion on a broad range of substrate materials

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Increased adhesion of evaporated metals to substrate materials

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Reduced z-potential for improved coating properties

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Replaces pre-wetting solvents

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Improved wet chemical resistance

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May eliminate the need for thermally matched glass

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Eliminates need for substrate dehydration bake prior to resist coating

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Non-Hazardous waterborne formulation.

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No VOC or hazardous breakdown products

SurPass demonstrates excellent adhesion properties on a wide range of substrate materials, including glass, silicon nitride, metals, metal oxides, ceramics (ruby, sapphire) and plastics (PET). SurPass is compatible with most positive and negative resist and polymer formulations, providing excellent adhesion when used in conjunction phenolformaldehyde resins (DNQ/Novolac), poly methyl methacrylate (PMMA), poly methylglutarimide (PMGI), epoxy based polymer (SU8), polyimide, electron beam and chemically amplified resists.

In addition to promoting adhesion, SurPass modifies the available surface energy to provide a more uniform coating surface for improved resist flow . Evidence suggests that SurPass may be used in polyimide processing to both improve performance and reduce material consumption through reduced Zeta potential. SurPass provides improved coating flow and uniformity even where resist / polymer adhesion is not an issue.

SurPass is manufactured in two versions designated as SurPass 3000 and SurPass 4000. SurPass 3000 is mildly acidic (3.0-3.5) and contains a cleaning and surfactant package for enhanced performance. SurPass 4000 is slightly alkaline (9.0-9.5) and contains no additives. Both versions are waterborne and non-hazardous. Unlike silanes (HMDS), SurPass is not limited to Si-substrates materials. No ammonia or breakdown products are formed during application. Both versions of SurPass are waterborne, non-hazardous, and contain no volatile organic compounds (VOC’s).