DisCharge is an anti-charging agent used in electron-beam lithography for preventing charge accumulation on electrically insulated substrates. DisCharge is water based and easily removed with water or IPA. DisCharge H2O is available in standard (1X), 2X and 4X formulations with film thickness doubling and sheet decreasing proportionally to the incremental increase in concentration.
One of our standout products is DisCharge, a spin-on anti-charging agent specifically designed for electron beam lithography. This innovative solution helps reduce charge accumulation on insulating substrates, which is a common problem in EBL processes. By addressing this issue, DisCharge ensures better positional accuracy and improved lithographic outcomes.
Have you ever noticed that your lithographic patterns suffer from poor fidelity or unexpected distortions? This is often due to charge accumulation on insulating substrates like fused silica, glass slides, and PDMS. Our E Beam Lithography Charge Dissipation Agent, DisCharge, is designed to mitigate these problems. It works seamlessly with positive resists such as PMMA, ZEP520A, CSAR 62, and mr-PosEBR, ensuring that charge accumulation does not compromise your work.
The effectiveness of DisCharge as an EBL Charge Dissipation Agent is backed by solid evidence. In experiments conducted with different resists and substrates, DisCharge consistently prevented charge accumulation, resulting in better pattern fidelity and substrate integrity. Whether working with PMMA, ZEP520A, or CSAR 62, DisCharge ensures that your electron beam lithography processes deliver the high-quality results you need.
DisCharge has been extensively tested and proven to be effective at the Singh Center for Nanotechnology Quattrone Nanofabrication Facility. Researchers Gerald G. Lopez, Ph.D., and Glen de Villafranca have documented the remarkable performance of DisCharge, in reducing charge accumulation during EBL processes. Their studies show significant improvements in pattern accuracy and substrate integrity when using DisCharge.
The effectiveness of DisCharge as an EBL Charge Dissipation Agent is backed by solid evidence. In experiments conducted with different resists and substrates, DisCharge consistently prevented charge accumulation, resulting in better pattern fidelity and substrate integrity. Whether working with PMMA, ZEP520A, or CSAR 62, DisCharge ensures that your electron beam lithography processes deliver the high-quality results you need.
Our DisCharge product has been thoroughly tested at the Singh Center for Nanotechnology, where it demonstrated its ability to reduce charge accumulation on insulating substrates. This reduction in charge buildup leads to improved positional accuracy of the electron beam and better overall lithographic performance. DisCharge has been shown to be effective on substrates like fused silica, glass slides, and PDMS, making it a versatile solution for a wide range of applications.
At DisChem, we are dedicated to providing solutions that enhance your lithography processes. DisCharge, our advanced Electron Beam Lithography Charge dissipation agent, addresses the critical issue of charge accumulation, ensuring better pattern accuracy and substrate integrity. With DisCharge, you can achieve the precision and efficiency your projects demand.
Ready to improve your lithography results? Contact us today to learn more about DisCharge and our other innovative products. Let’s tackle your lithography challenges together.
DisCharge H₂O is a water-based anti-charging agent formulated for electron beam lithography. It prevents charge accumulation on electrically insulating substrates, ensuring accurate beam placement, limiting pattern distortion, and improving overall lithographic performance on non-conductive surfaces.
Using DisCharge H₂O can reduce charge-induced defects and pattern failures, leading to fewer reworks and higher yield. Effective charge control improves repeatability and consistency across research and industrial EBL workflows.
Anti-charging agents prevent static charge buildup on insulating substrates during electron beam exposure. Without charge dissipation, accumulated electrons can distort the beam path, leading to pattern displacement, reduced resolution, and inconsistent feature sizes in high-precision e-beam lithography processes.
DisCharge is DisChem’s proprietary anti-charging agent designed to form a thin conductive layer on substrates. This layer safely dissipates excess electrons during exposure, helping maintain beam stability, accurate pattern placement, and improved lithography results on non-conductive surfaces.
Unlike metal coatings, DisCharge is water based and easily removable. It integrates into standard spin coating workflows, does not require vacuum deposition, and can be rinsed away after exposure without damaging the resist or underlying substrate.
DisCharge is applied by spin coating over the resist or substrate following recommended protocols. After e-beam exposure, it can be easily removed using deionized water or isopropyl alcohol prior to resist development.
Yes. DisCharge is formulated to be gentle on sensitive substrates. Its water-based chemistry and mild removal process reduce the risk of surface damage, making it suitable for fragile materials and precision nanofabrication workflows.
Anti-charging agents prevent static charge buildup on insulating substrates during electron beam exposure. Without charge dissipation, accumulated electrons can distort the beam path, leading to pattern displacement, reduced resolution, and inconsistent feature sizes in high-precision e-beam lithography processes.
Insulating materials such as glass, fused silica, and polymers cannot dissipate excess electrons during exposure. This trapped charge deflects the electron beam, causing image drift, pattern distortion, and loss of critical dimension control during electron beam lithography.
DisCharge is DisChem’s proprietary anti-charging agent designed to form a thin conductive layer on substrates. This layer safely dissipates excess electrons during exposure, helping maintain beam stability, accurate pattern placement, and improved lithography results on non-conductive surfaces.
Unlike metal coatings, DisCharge is water based and easily removable. It integrates into standard spin coating workflows, does not require vacuum deposition, and can be rinsed away after exposure without damaging the resist or underlying substrate.
DisCharge is compatible with commonly used electron beam resists including PMMA, ZEP, CSAR, and other positive and negative tone resists. Proper application ensures charge dissipation without interfering with resist adhesion, exposure sensitivity, or development performance.
DisCharge is applied by spin coating over the resist or substrate following recommended protocols. After e-beam exposure, it can be easily removed using deionized water or isopropyl alcohol prior to resist development.
When used correctly, DisCharge does not interfere with resist development or pattern formation. Instead, it improves feature quality by minimizing beam deflection, resulting in sharper edges, better alignment accuracy, and improved pattern fidelity at nanoscale dimensions.
DisChem offers DisCharge in multiple concentrations to accommodate different process requirements. Higher concentrations provide increased conductivity for challenging substrates, while lower concentrations support thinner films for applications requiring minimal coating thickness.
Anti-charging agents are especially beneficial for insulating substrates such as glass, fused silica, quartz, polymers, and oxides. These materials are prone to charge accumulation during e-beam exposure and often require additional charge dissipation for reliable patterning.
By dissipating excess electrons, DisCharge stabilizes the electron beam during exposure. This reduces pattern drift and placement errors, allowing the beam to follow its intended path and produce accurate, repeatable nanoscale features across the substrate.
DisCharge is designed for flexibility and reliability, making it suitable for academic research labs, prototyping facilities, and industrial manufacturing environments where consistent e-beam lithography performance is required across multiple runs and applications.
No. DisCharge integrates seamlessly into existing spin coating and rinse steps. It does not require additional equipment or specialized removal processes, making it a simple and effective solution for managing charge accumulation in e-beam lithography.
DisCharge offers easier removal, cleaner processing, and strong compatibility with common resists. Unlike some conductive polymers, it minimizes residue risk while providing effective charge dissipation without introducing additional contamination or processing complications.
Yes. DisCharge is formulated to be gentle on sensitive substrates. Its water-based chemistry and mild removal process reduce the risk of surface damage, making it suitable for fragile materials and precision nanofabrication workflows.
Optimized by Seraphinite Accelerator
