Superior Micro / Nano Resist Adhesion for Advanced Lithography
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Advantages in Lithographic Processing
Publications
Reduced Zeta potential through use of cationic adhesion promoter for improved resist process performance and minimizing material consumption
Electron dose reduction through improved adhesion by cationic organic material with HSQ resist on an InGaAs multilayer system on GaAs substrate
Improved Adhesion by Surfscan for 30nm HSQ Column Arrays on a InGaAs / GaAs Multilayer System (presentation)
Improved adhesion of novolac and epoxy based resists by cationic organic materials on critical substrates for high volume patterning applications
Metal Free Seedless Adhesion of Au on Si Native Oxide
FAQs
1. What does DisChem, Inc. specialize in?
DisChem, Inc. develops and supplies specialty chemical solutions for microlithography, electron beam lithography, optical media, and electroforming processes. The company is recognized for precision-focused formulations that improve adhesion, minimize defects, and enhance process reliability in advanced micro- and nano-fabrication environments.
2. Why is adhesion critical in microlithography processes?
Adhesion directly impacts pattern stability throughout coating, exposure, and development stages. Poor adhesion can lead to resist lifting, pattern distortion, or collapse. Strong adhesion ensures accurate pattern transfer, improved yields, and consistent performance across complex micro- and nano-scale substrates.
3. What is SurPass and how is it used in microlithography?
4. How does SurPass improve resist adhesion without damaging the surface?
SurPass forms a thin cationic layer that increases surface energy and promotes resist attachment. Unlike aggressive treatments, it does not etch, roughen, or chemically alter the substrate, preserving surface integrity while delivering reliable and uniform adhesion performance.
5. What substrates are compatible with SurPass adhesion promoters?
SurPass is compatible with a wide range of substrates including glass, silicon, silicon nitride, metal oxides, metals, ceramics such as sapphire, and select polymers like PET. This broad compatibility supports diverse research, development, and manufacturing lithography applications.
6. What makes SurPass different from traditional adhesion promoters?
SurPass differs from solvent-based or silane adhesion promoters by being waterborne, non-hazardous, and free of VOCs. It delivers consistent adhesion across multiple substrates while reducing safety risks, environmental impact, and process complexity associated with conventional adhesion methods.
7. What is the difference between SurPass 3000 and SurPass 4000?
SurPass 3000 is mildly acidic and includes surfactant and cleaning functionality, while SurPass 4000 is slightly alkaline and additive-free. Both formulations are cationic and waterborne, allowing users to select the best option for their specific substrate and process needs.
8. Can SurPass be used with both positive and negative resists?
Yes, SurPass is compatible with a broad range of resist chemistries, including both positive and negative resists. It has demonstrated effectiveness with PMMA, SU-8, DNQ/Novolac systems, and other commonly used resists in microlithography and e-beam lithography.
9. Does SurPass affect resist coating uniformity?
By modifying surface energy, SurPass improves resist wetting and flow during spin coating. This results in more uniform films, fewer coating defects, and improved critical dimension control, particularly on substrates with challenging or low surface energy characteristics.
10. Is SurPass environmentally friendly and safe to handle?
11. Can SurPass help reduce electron beam exposure dose?
Improved adhesion achieved with SurPass can result in more stable resist patterns during exposure and development. In certain applications, this enhanced stability has enabled reduced electron beam exposure doses while maintaining resolution and pattern fidelity.
12. Does using SurPass eliminate additional surface preparation steps?
In many processes, SurPass can reduce or eliminate the need for dehydration baking or solvent pre-wetting steps. This streamlines workflows, shortens processing time, and reduces chemical usage without compromising adhesion or lithographic performance.
13. How does better adhesion improve fabrication yield?
Stronger adhesion minimizes resist lifting, peeling, and pattern distortion during development. By reducing defects and rework, SurPass improves process repeatability and overall yield, which is essential for high-precision micro- and nano-fabrication applications.
14. Can SurPass enhance metal adhesion in lithographic processes?
Yes, SurPass can improve adhesion between substrates and evaporated metals. This is particularly valuable in metallization and electroforming applications where strong metal-to-substrate bonding is critical for mechanical stability and downstream processing reliability.
15. Is SurPass suitable for both research and production environments?
SurPass is widely used in research laboratories and production environments. Its ease of application, consistent results, and broad substrate compatibility make it ideal for prototyping, process development, and scalable manufacturing workflows.